| 1 | Basic soldering technique is applied. | |
| 2 | In the test the solder ability plating coating. | |
| 3 | Short the parts of LD circuit pattern by soldering( refer to page 7) . | |
| 4 | Apply to factory and individual electronic product soldering tin handle. | |
| 5 | The schematic for the DTMF decoder in the figure below. Again you can use a combination of wire wrapping and soldering. Part placement is not critical. |
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